Who, just a few years ago, had heard of the RoHS, temperature profiles, ESD, MSL, popcorn cracking effect, etc.? Today companies in our industry must control all these parameters. All our products, whether a prototype or mass production series, meet the highest production and quality control standards. Moreover we guarantee for two years all products that have left our factory verified with our quality mark .
The solid state electronic devices (ESD) are very sensitive to electrostatic discharge as it could compromise the components' functions. In particular in integrated circuits because of the use of semiconductor materials such as silicon and silicon dioxide that can be permanently damaged due to the exposure to this type of load. To prevent these problems Folegax works with EPA's (or electrostatic protection areas) to protect the electronic equipment at risk of damage from electrostatic discharge. Therefore, the handling, transport and storage iscarried out using products made from conductive materials.
Directive 2002/95/EC on the Restriction of certain Hazardous Substances in electrical and electronic equipment (RoHS English "Restriction of Hazardous Substances"), was adopted in February 2003 by the European Union. Having entered into force on 1 July 2006 it restricts the use of six hazardous materials (lead, mercury, cadmium, chromium VI, PBB, PBDE) in the manufacture of various types of electrical and electronic equipment and is very intimatly related with the Waste Electrical and Electronic Equipment (WEEE for its acronym in English). In Spain, together with the RoHS Directive WEEE (in Spanish known by its acronym RAEE "Recycling of Electrical and Electronic Equipment") establish minimum criteria to restrict the content of lead in solders for the electronics. This changes demanded Folegax to acquire expensive new tools for assembly lines, and various coatings for the electronics terminals. Alternatives for welds typically have higher melting points (260 ° C, instead of only 215 ° C), which entails the use of different materials for the packaging of integrated circuits and some printed circuits.
FREE CRACKING PROCESS by FOLEGAX
Our process avoids reworking welding and microcracks creation in the material due to the presence of moisture causing delamination of the PCB holder and serious problems in the assembly process.
FOLEGAX TEMPERATURE PROFILES
We own an independent generator of temperature profiles.